SFX Services for this record
Language
English
Dutch
Spanish
Title:
Investigation of a solder bumping technique for flip-chip interconnection
Source:
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) [0-7803-5502-4] Hutt, David
yr:1999
Basic
(
Passwords for e-Journals can be found here
)
Full Text
Full text available via
IEEE Electronic Library (IEL) Conference Proceedings
Authentication:
Login to VPN for off campus access
.
Advanced
Full text for other editions
Proceeding: Electronics Manufacturing Technology Symposium, IEEE/CHMT(CPMT) International [1089-8190]
Full text available via
IEEE Xplore All Conference Series
© 2005 SFX by Ex Libris Inc.
