SFX SFX Services for this record
Language
Title: Scanning acoustic microscopy investigation of engineered flip-chip delamination
Source:

Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) [0-7803-6482-1] Hutt, David

yr:2000
Collapse list of basic services Basic (Passwords for e-Journals can be found here )

Full Text

Full text available via IEEE Electronic Library (IEL) Conference Proceedings GO
Authentication: Login to VPN for off campus access.
Expand list of advanced services Advanced