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Title:
Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects
Source:
IEEE Transactions on Components and Packaging Technologies [1521-3331] Li, Jianfeng yr:2008
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Merged into: IEEE Transactions on Advanced Packaging [1521-3323]
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Merged into: IEEE Transactions on Electronics Packaging Manufacturing [1521-334X]
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